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Hot embossing of microstructures with integrated conduction paths for the production of lab- on -chip systems

Author(s):
Publication title:
Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4755
Pub. Year:
2002
Page(from):
670
Page(to):
674
Pages:
5
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819445186 [0819445185]
Language:
English
Call no.:
P63600/4755
Type:
Conference Proceedings

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