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Strength and long-term reliability testing of wafer-bonded MEMS

Author(s):
  • Petzold, M. ( Fraunhofer-Institut fuer Werkstoffmechanik (Germany) )
  • Katzer, D.
  • Wiemer, M. ( Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany) )
  • Bagdahn, J. ( Fraunhofer-Institut fuer Werkstoffmechanik (Germany) )
Publication title:
Design, test, integration, and packaging of MEMS/MOEMS 2002 : 6-8 May, 2002, Cannes, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4755
Pub. Year:
2002
Page(from):
613
Page(to):
623
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819445186 [0819445185]
Language:
English
Call no.:
P63600/4755
Type:
Conference Proceedings

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