Thermomechanical modeling of the pin-chucked EUV reticle during exposure

Thermomechanical modeling of the pin-chucked EUV reticle during exposure

Author(s):

Wei, A.C. ( Univ. of Wisconsin/Madison (USA) )

Blaedel, K.L. ( Lawrence Livermore National Lab. (USA) )

2 more

Publication title:

Emerging Lithographic Technologies VI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4688

Pub. Year:

2002

Vol.:

Part Two

Page(from):

743

Page(to):

754

Pages:

12

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819444349 [0819444340]

Language:

English

Call no.:

P63600/4688

Type:

Conference Proceedings

Details

TDL ID:	ZA00012520
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Emerging lithographic technologies
Conf. info. (Number):	2002 : 6th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2002.03.05-2002.03.07

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