Low-temperature wafer-scale warm embossing for mix and match with UV lithography

Low-temperature wafer-scale warm embossing for mix and match with UV lithography

Author(s):

Schulz, H. ( Univ. of Wuppertal (Germany) )

Wissen, M.

Roos, N.

Scheer, H.-C.

Pfeiffer, K. ( micro resist technology GmbH (Germany) )

Gruetzner, G.

1 more

Publication title:

Emerging Lithographic Technologies VI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4688

Pub. Year:

2002

Vol.:

Part One

Page(from):

223

Page(to):

231

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819444349 [0819444340]

Language:

English

Call no.:

P63600/4688

Type:

Conference Proceedings

Details

TDL ID:	ZA00012519
Series ID:	PA00000029
Conf. info. (Name):	Emerging lithographic technologies
Conf. info. (Number):	2002 : 6th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2002.03.05-2002.03.07

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