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Experimental methods for thermomechanical characterization of electronic packages: a review and evaluation

Author(s):
Yi, S. ( Nanyang Technological Univ. (Singapore) )
Su, F.
Dai, F.
He, X. ( Southeast Univ. (China) )
Xie, H. ( Nanyang Technological Univ. (Singapore) )
Vora, M.
1 more
Publication title:
Semiconductor Optoelectronic Device Manufacturing and Applications
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4602
Pub. Year:
2001
Page(from):
214
Page(to):
224
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819443410 [0819443417]
Language:
English
Call no.:
P63600/4602
Type:
Conference Proceedings

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