Micro-moire for thermal deformation investigation in electronics packaging

Micro-moire for thermal deformation investigation in electronics packaging

Author(s):

Zhong.Z.W. ( Nanyang Technological Univ. (Singapore) )
Lim, S.C.
Asundi, A.K.
Chai, T.C. ( Institute of Microelectronics (Singapore) )

Publication title:

Advanced photonic sensors and applications II : 27-30 November 2001, Singapore

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4596

Pub. Year:

2001

Page(from):

256

Page(to):

260

Pages:

5

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819443267 [0819443263]

Language:

English

Call no.:

P63600/4596

Type:

Conference Proceedings

Details

TDL ID:	ZA00012424
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Photonics and Applications : Advanced photonic sensors and applications
Conf. info. (Number):	2001 : 2nd
Conf. info. (Venue):	Singapore
Conf. info. (Date):	2001.11.27-2001.11.30

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