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Study of Underfill Resin Properties for High Performance Flip-Chip BGA Package

Author(s):
Publication title:
Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4587
Pub. Year:
2001
Page(from):
588
Page(to):
593
Pages:
6
Pub. info.:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815646 [0930815645]
Language:
English
Call no.:
P63600/4587
Type:
Conference Proceedings

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