In Situ Ultrasonic Stress Microsensor for Second Bond Characterization
- Author(s):
- Schwizer, Juergen ( ETH Zurichi )
- Brand Oliver
- Baltes, Henry
- Mayer, Michael ( ESEC )
- Publication title:
- Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4587
- Pub. Year:
- 2001
- Page(from):
- 338
- Page(to):
- 343
- Pages:
- 6
- Pub. info.:
- Washington, DC: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815646 [0930815645]
- Language:
- English
- Call no.:
- P63600/4587
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
In-Situ Measurement of Chip Temperature during Soft Solder Die Bonding using Integrated Microsensors
SPIE - The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
2
Conference Proceedings
Ultrasonic Bonding: Understanding How Process Parameters determine the Strength of Au-Al Bonds
IMAPS |
Trans Tech Publications |
3
Conference Proceedings
Discrimination of volatile organic compounds using CMOS capacitive chemical microsensors with thickness-adjusted polymer coating
SPIE - The International Society for Optical Engineering |
9
Conference Proceedings
Flip-chip packaged CMOS chemical microsystem for detection of volatile organic compounds
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE - The International Society for Optical Engineering |
MRS-Materials Research Society |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |