The Technology of Flip Chip Bonding on an Organic Substrate for PDA

The Technology of Flip Chip Bonding on an Organic Substrate for PDA

Author(s):

Makabe, Akira ( SEIKO EPSON Corporation )
Kurashima, Yohei
Shimizu, Statoshi
Inoue, Shigeki

Publication title:

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4587

Pub. Year:

2001

Page(from):

287

Page(to):

292

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815646 [0930815645]

Language:

English

Call no.:

P63600/4587

Type:

Conference Proceedings

Details

TDL ID:	ZA00012415
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Advanced Packaging Materials
Conf. info. (Number):	2001
Conf. info. (Venue):	Braselton, Georgia, USA
Conf. info. (Date):	2001.03.11-2001.03.14

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