High Density Packaging using Flip Chip Technology in Mobile Communicaton Equipment

High Density Packaging using Flip Chip Technology in Mobile Communicaton Equipment

Author(s):

Nishida, Kazuto ( Matsushita Electric Industrial Co., Ltd. )

Okamoto, Izumi ( Matsushita Electric Components Co. Ltd. )

Abe Kouji ( Matsushita Communication Industiral Co., Ltd. )

Kouzou, Takada

Ema, Tomiyo

Koguchi, Hideo ( Nagaoka University of Technology )

Sasaki, Chie

6 more

Publication title:

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4587

Pub. Year:

2001

Page(from):

272

Page(to):

277

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815646 [0930815645]

Language:

English

Call no.:

P63600/4587

Type:

Conference Proceedings

Details

TDL ID:	ZA00012415
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Advanced Packaging Materials
Conf. info. (Number):	2001
Conf. info. (Venue):	Braselton, Georgia, USA
Conf. info. (Date):	2001.03.11-2001.03.14

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