Photo Patterned Conductors with LTCC for Microwave and High Density Interconnect

Photo Patterned Conductors with LTCC for Microwave and High Density Interconnect

Author(s):

Barnwall, Peter ( Heraeus Inc., Circuit Materials Division )
Smith, Brent
Ehlert, Michael ( National Semicon- ductor Corporation )

Publication title:

Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4587

Pub. Year:

2001

Page(from):

149

Page(to):

154

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815646 [0930815645]

Language:

English

Call no.:

P63600/4587

Type:

Conference Proceedings

Details

TDL ID:	ZA00012415
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Advanced Packaging Materials
Conf. info. (Number):	2001
Conf. info. (Venue):	Braselton, Georgia, USA
Conf. info. (Date):	2001.03.11-2001.03.14

Similar Items:

1 Conference Proceedings "High Density LTCC Technology, Using Photo Patterned Conductors" Barnwell,Peter, Ehlert,Michael SPIE-The International Society for Optical Engineering	7 Conference Proceedings PERFORMANCE OF LTCC MATERIALS SYSTEMS IN 2 GHZ RESONATOR APPLICATIONS Ehlert,Michael R., Draudt,Rick IMAPS
2 Conference Proceedings MICROWAVE MCM-C UTILIZING LOW LOSS LTCC AND PHOTO-PATTERNING PROCESSES Barnwell,Peter G., O'Neill,Michael P., Sabo,Charles, Free,Charles IMAPS	8 Conference Proceedings Characterization of Unrestrained Zero Shrink LTCC Material System for Volume Production of RF LTCC Modules Ehlert, Michael, Spenser, Barbie, Lautzenhiser, Frans, Amaya, Edmar IMAPS
3 Conference Proceedings Embedded High K Ceramic Capacitors in LTCC for Wireless Communication Applications Ehlert,Michael R., Branchevsky,Shaul SPIE - The International Society for Optical Engineering	9 Conference Proceedings 3-D Filp Chip Packaging in LTCC for High Density Microwave Applications Marsh,W., Kline,M., Kuss,F., Strack,D., Berry,M. SPIE-The International Society for Optical Engineering
4 Conference Proceedings LARGE AREA LTCC SUBSTRATE AND HIGH DENSITY OFF-MODULE INTERCONNECT DEVELOPMENTS Palmer,Edward G., Newton,C.Michael IMAPS	10 Conference Proceedings Reliability Assessment and Growth of an MCM High Density Interconnect Overlay Structure Eric Smith Society of Photo-optical Instrumentation Engineers
5 Conference Proceedings LTCC Materials for High Density Multilayer Interconnect Hsu,Jen-Yan, Hsu,Chin-Jung, Huang,Yu-Ting, Hung,Ying-Chang, Ko,Wen-Song, Lee,Yung-Jian, Lin,Hong-Ching IMAPS, SPIE-The International Society for Optical	11 Conference Proceedings Nano-spring arrays for high-density interconnect Fork,D.K., Chua,C.L., Kim,P., Romano,L.T., Lau,R., Wong,L., Alimonda,A., Geluz,V., Teepe,M., Haemer,J., Modi,M., Zhu,Q., … SPIE-The International Society for Optical Engineering
6 Conference Proceedings Effect of Processing Variables on the Co-Fired Properties of Thick Film Resistors in LTCC Ehlert,Michael, Munoz,Patrick S. SPIE - The International Society for Optical Engineering, IMAPS	12 Conference Proceedings Laser direct imaging of high-density interconnect patterns on PCB [6157-24] Barbucha, R., Kocik, M., Mizeraczyk, J., Koziot, G., Borecki, J. SPIE - The International Society of Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12