On-Wafer Process for Stress-Free Area Array Floating Pads
- Author(s):
- Fillion, Raymond A. ( GE Corporate R&D )
- Wojnarowski, Robert J.
- Cole, Herbert
- Claydon, Glenn
- Publication title:
- Proceedings : International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 11-14, 2001
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4587
- Pub. Year:
- 2001
- Page(from):
- 100
- Page(to):
- 105
- Pages:
- 6
- Pub. info.:
- Washington, DC: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815646 [0930815645]
- Language:
- English
- Call no.:
- P63600/4587
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
Society of Plastics Engineers, Inc. (SPE) |
Society of Photo-optical Instrumentation Engineers |
IMAPS |
SPIE-The International Society for Optical Engineering |
American Institute of Chemical Engineers |
4
Conference Proceedings
POLYMERIC MATERIALS REQUIREMENTS FOR THE GE HIGH-DENSITY INTERCONNECT PROCESS
Materials Research Society |
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
American Institute of Chemical Engineers |
SPIE-The International Society for Optical Engineering |
American Institute of Chemical Engineers |