Inspection system for microelectronics BGA package using wavelength scanning interferometry

Inspection system for microelectronics BGA package using wavelength scanning interferometry

Author(s):

Kang,C.M. ( Korea Advanced Institute of Science and Technology )
Woo,H.G.
Cho,H.S.
Hahn,J.W.
Lee,J.Y.

Publication title:

Optomechatronic systems II : 29-31 October 2001, Newton, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4564

Pub. Year:

2001

Page(from):

74

Page(to):

85

Pages:

12

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819442925 [0819442925]

Language:

English

Call no.:

P63600/4564

Type:

Conference Proceedings

Details

TDL ID:	ZA00012278
Series ID:	PA00000029
Conf. info. (Name):	Photonics East : Optomechatronic systems
Conf. info. (Number):	2001 : 2nd
Conf. info. (Venue):	Newton, MA, USA
Conf. info. (Date):	2001.10.29-2001.10.31

Similar Items:

1 Conference Proceedings Reliability of FBGA(Fine Pitch BGA)Package using PCB Substrate Ahn,E.C., Cho,T.J., Hyun,H.S., Chung,T.G., Oh,S.Y. SPIE - The International Society for Optical Engineering	7 Conference Proceedings Reliability of Lead Free BGA Packages Prasad,Swaminath, Carson,Flynn, Kim,G.S., Lee,J.S., Jeong,T.S., Kim,Y.S. IMAPS
2 Conference Proceedings In-process layer surface inspection of SLA products Park,W.S., Kim,M.Y., Lee,H.G., Cho,H.S., Leu,M.C. SPIE - The International Society for Optical Engineering	8 Conference Proceedings Simulation and experiments for inspection properties of EUV mask defects [6283-85] Park, J., Kim, -S. S., Lee, S., Woo, -G. S., Cho, -K. H., Moon, -T. J. SPIE - The International Society of Optical Engineering
3 Conference Proceedings Inspection of ball grid array(BGA)solder joints using x-ray cross-sectional images Roh,Y.J., Ko,K.W., Cho,H.S., Kim,H.C., Joo,H.N., Kim,S.K. SPIE - The International Society for Optical Engineering	9 Conference Proceedings Toward DFM: process worthy design and OPC through verification method using MEEF, TF・MEEF, and MTT [6156-21] Kim, I.-S., Suh, S., Jung, S., Lee, E., Kang, Y.-S., Lee, S., Woo, S.-G., Cho, H. SPIE - The International Society of Optical Engineering
4 Conference Proceedings Defect inspection of EUVmask blank using confocal microscopy: simulation and experiment [6151-49] Kim, S. S., Park, J., Chalykh, R., Kang, J., Lee, S., Woo, S. G., Cho, H. K., Moon, J. T. SPIE - The International Society of Optical Engineering	10 Conference Proceedings Most feasible curing process for ArF resists in device integration aspect Kim, H.-W., Kang, Y., Lee, J.-H., Chae, Y.-S., Woo, S.-G., Cho, H.-K., Han, W.-S. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Visual inspection system with flexible illumination and autofocusing Roh, Y.J., Lee, D.Y., Kim, M.Y., Cho, H.S. SPIE-The International Society for Optical Engineering	11 Conference Proceedings Wavelength Tunable Optical Isolator Possessing Linear Birefringence, Cho,S.Y., Kang,H.S., Lee,K.S. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Low Cost and High Effective Thermal Management using PBGA MCM Package Kim,S.G., Chung,D.E., Woo,J.H., Lim,S.W., Lee,C.K. IMAPS	12 Conference Proceedings Organic electroluminescent devices using poly(vinylidene fluoride-co-hexafluoropropylene) doped with triphenylamine derivative as a hole-transporting layer Kang,E., Keum,J.H., Lee,J.-G., Kim,Y., Cho,W.-J., Ha,C.-S. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12