Blank Cover Image

"Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging"

Author(s):
Publication title:
Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Trancisco, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4558
Pub. Year:
2001
Page(from):
260
Page(to):
267
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819442864 [0819442860]
Language:
English
Call no.:
P63600/4558
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Evalution of Flip Chip Interconnects Using Acoustic Microscopy for Failure Analysis and Process Control Applications

Janet E. Semmens, S.R. Martell, L.W. Kessler

Society of Photo-optical Instrumentation Engineers
7 Conference Proceedings Miniaturized laser magnetometers and clocks

Wynands, R., Affolderbach, C., Hollberg, L.W., Kitching, J.E., Knappe, S.A., Staehler, M.

SPIE-The International Society for Optical Engineering
2 Conference Proceedings Analyzing MCM-C Multilayer Defects by Using Acoustic Micro Imaging

Harsanyi,Gabor, Percsi,L., Semmens,J.E., Martell,S.R., Toth,E.

SPIE - The International Society for Optical Engineering, IMAPS
8 Conference Proceedings Mass Transfer in Various Hollow Fiber Geometries

Wicksramasinghe, S. R., Semmens, Michael. J., Cussler, E. L.

American Institute of Chemical Engineers
3 Conference Proceedings Matching analysis on seven manufacturing CD SEMs

Bowley,R.R.,Jr., Beecher,J.E., Cogley,R.M., Dupuis,S.R., Farrington,D.L.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Low Profile Packaging for MEMS Aero-acoustic Sensors

John R. Burns, Robert D. White, Joshua S. Krause

Materials Research Society
4 Conference Proceedings Reliability Analysis of a SLIM/SHOCC Package

Selvam,R.Panneer, Schaper,L.W., Peng,Y.

IMAPS, SPIE-The International Society for Optical
10 Conference Proceedings Structural tests using a MEMS acoustic emission sensor [6174-02]

Oppenheim, I. J., Greve, D. W., Ozevin, D., Hay, D. R., Hay, T. R., Pessiki, S. P., Tyson, N. L.

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Imputation methods for temporal radiographic texture analysis in the detection of periprosthetic osteolysis

J. R. Wilkie, M. L. Giger, L. L. Pesce, C. A. Eneh Sr., R. H. Hopper, Jr., J. M. Martell

SPIE - The International Society of Optical Engineering
11 Conference Proceedings Probing the pore space in mesoporous solids with NMR spectroscopy and magnetic resonance microimaging

Breeze, S. R., Lang, S. J., Nosov, A. V., Sanchez, A., Moudrakovski, I. L., Ratcliffe, C. I., Ripmeester, J. A.

Elsevier
6 Conference Proceedings Mechanical Behavior of a MEMS Acoustic Emission Sensor

Bahr, D. F., Wright, J. S., Francis, L. F., Moody, N. R., Gerberich, W. W.

MRS - Materials Research Society
12 Conference Proceedings Printing systems for MEMS packaging

Hayes,D.J., Cox,W.R., Wallace,D.B.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12