Blank Cover Image

Strength assessment of wafer-bonded micromechanical components using the micro-chevron test

Author(s):
Publication title:
Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Trancisco, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4558
Pub. Year:
2001
Page(from):
133
Page(to):
142
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819442864 [0819442860]
Language:
English
Call no.:
P63600/4558
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test

Bagdahn, J., Ploessl, A., Wiemer, M., Petzold, M.

Electrochemical Society
7 Conference Proceedings Characterisation of Directly Bonded Silicon Wafers by Means of the Double Cantilever Crack Opening Method

Bagdahn, J., Petzold, M., Reiche, M., Gutjahr, K.

Electrochemical Society
2 Conference Proceedings Lifetime Properties of Wafer-Bonded Components under Static and Cyclic Loading

Bagdahn, J., Petzold, M.

Electrochemical Society
8 Conference Proceedings Interface Strength Characterization of Bonded Wafers

Petzold, M., Petersilge, M., Abe, T., Reiche, M.

Electrochemical Society
3 Conference Proceedings Strength and long-term reliability testing of wafer-bonded MEMS

Petzold, M., Katzer, D., Wiemer, M., Bagdahn, J.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Comparison of the Mechanical Properties of Low Temperature Bonded Test Samples

J. Bagdahn, M. Bernasch, C. Fischer, M. Wiemer

Electrochemical Society
4 Conference Proceedings The Influence of Sharp Notches on the Strength of Directly Bonded Components

Bagdahn, J., Katzer, D., Petzold, M., Wiemer, M.

Electrochemical Society
10 Conference Proceedings Wafer-scale replication and testing of micro-optical components for VCSELs

Gimkiewicz, C., Moser, M., Obi, S., Urban, C., Pedersen, J.S., Thiele, H., Zschokke, C., Gale, M.T.

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Mechanical Reliability of Directly Bonded Silicon MEMS Components

Bagdahn, J., Wiemer, M., Petzold, M.(Invited)

Electrochemical Society
11 Conference Proceedings Fracture toughness and fatigue investigations of polycrystalline silicon

Bagdahn,J., Schischka,J., Petzold,M., Sharpe Jr.,W.N.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Mechanical Characterization and Micro Structure Diagnostics of Glass Frit Bonded Interfaces

B. Boettge, C. Dresbach, A. Graff, M. Petzold, J. Bagdahn

Electrochemical Society
12 Conference Proceedings MICROMECHANICAL TESTING OF ELECTRONIC PACKAGING COMPONENTS AND MATERIALS

Li, C. -Y., Yost, B., Korhonen, M. A., Dion, J.

MRS - Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12