Method for testing electrostatic discharge tolerance for fingerprint sensor LSI

Method for testing electrostatic discharge tolerance for fingerprint sensor LSI

Author(s):

Tanade,Y. ( NTT Telecommunications Energy Labs. )

Publication title:

Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Trancisco, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4558

Pub. Year:

2001

Page(from):

81

Page(to):

88

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819442864 [0819442860]

Language:

English

Call no.:

P63600/4558

Type:

Conference Proceedings

Details

TDL ID:	ZA00012272
Series ID:	PA00000029
Conf. info. (Name):	Micromachining and Microfabrication : Reliability, Testing, and Characterization of MEMS/MOEMS
Conf. info. (Number):	2001
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2001.10.22-2001.10.24

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