Gold damascene interconnect technology for millimeter-wave photonics on silicon
- Author(s):
Ishii,H. ( NTT Telecommunications Energy Labs. ) Yagi,S. Minotani,T. Royter,Y. Kudou,K. Yano,M. Nagatsuma,T. Machida,K. Kyuragi,H. - Publication title:
- Micromachining and microfabrication process technology VII : 22-24 October 2001, San Francisco, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4557
- Pub. Year:
- 2001
- Page(from):
- 210
- Page(to):
- 219
- Pages:
- 10
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819442857 [0819442852]
- Language:
- English
- Call no.:
- P63600/4557
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Method for testing electrostatic discharge tolerance for fingerprint sensor LSI
SPIE-The International Society for Optical Engineering |
9
Conference Proceedings
A simple approach of high-purity millimeter-wave signal photonic generation
Society of Photo-optical Instrumentation Engineers |
4
Conference Proceedings
Self-assembled porous silica/Cu damascene interconnects for 45nm node and beyond (invited Papre) [6002-23]
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
Materials Research Society |