Blank Cover Image

Reliability of 96.5Sn-3.5Ac Lead-Free Solder-Bumped Wafer Level Chip Scale Package (WLCSP) on Build-Up Microvia Printed Circuit Board

Author(s):
Publication title:
Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4428
Pub. Year:
2001
Page(from):
314
Page(to):
322
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815639 [0930815637]
Language:
English
Call no.:
P63600/4428
Type:
Conference Proceedings

Similar Items:

1 Technical Paper Solder joint reliability of wafer level chip scale packages (WLCSP): A time-temperature-dependent creep analysis

Lau, John H., Lee, S.-W. Ricky, Chang, Chris, Chen, Chih-Chiang

The American Society of Mechanical Engineers
7 Conference Proceedings Wafer Level Chip Scale Packaging - Solder Joint Reliability

Nguyen,Luu T., Kelkar,N., Kao,T., Prabhu,A., Takiar,H.

SPIE - The International Society for Optical Engineering, IMAPS
2 Conference Proceedings Creep Behaviors of Flip Chip on Board with 96.5Sn-3.5Ag and 100 in Lead-Free Solder Joints

Lau,John H., Pan,Stephen H.

IMAPS
8 Conference Proceedings Lead-Free Solder Bump Technologies for Flip-Chip Packaging Applications

Karim, Zaheed S., Schetty, Rob

IMAPS
3 Conference Proceedings Effects of Underfill Delamination and Chip Size on the Reliability of Solder Bumped Flip Chip on Board

Lau,John H., Lee,S.-W.Ricky, Ouyang,Chien

SPIE - The International Society for Optical Engineering
9 Conference Proceedings Lead-Free Solder Bump Technologies for Flip-Chip Electronic Packaging Applications

Karim, Z.S., Chow, Alice, Cheung, Edwin, Cheung, Gary

SPIE-The International Society for Optical Engineering
4 Technical Paper Effects of printed circuit board thickness on solder joint reliability of flip chip assemblies with imperfect underfill

Lau, John H., Lee, S.-W. Ricky

The American Society of Mechanical Engineers
10 Conference Proceedings Nonlinear Fracture Mechanics Analysis of Wafer Level Chip Scale Package Solder Joints with Cracks

Lau,John H., Pan,Stephen H., Chang,Chris

IMAPS
5 Technical Paper Reliability of an 1657CCGA (Ceramic Column Grid Array) Package with 95.5Sn3.9Ag0.6Cu Lead- Free Solder Paste on PCBs (Printed Circuit Boards).

Lau, J., Dauksher, W.

American Society of Mechanical Engineers
11 Conference Proceedings Board Level Reliability of Chip Scale Packages

Wang,Z.P., Tan,Y.M., Chua,K.M.

SPIE - The International Society for Optical Engineering, IMAPS
6 Technical Paper Solder joint reliability of plastic ball grid array with solder bumped flip chip

Lee, S-W. Ricky, Lau, John H.

The American Society of Mechanical Engineers
12 Conference Proceedings Board Level Reliability of Chip Scale Packages

Hung,Sung-Ching, Zheng,P.J., Chen,H.N., Lee,S.C., Lee,J.J.

SPIE - The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12