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A Novel Low-Cost Pluggable Chip Scale Package for High-Pin-Count Applications

Author(s):
Wang,Ton ( Silicon Bandwidth, Inc. )
Ogata,Charley
Jeon,James
Crane Jr.,S.W.
Cangellaris,Andreas C.
Schutt-Aine,Jose
1 more
Publication title:
Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4428
Pub. Year:
2001
Page(from):
292
Page(to):
296
Pages:
5
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780930815639 [0930815637]
Language:
English
Call no.:
P63600/4428
Type:
Conference Proceedings

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