New Tools and Methods for the Thermal Transient Testing of Packages
- Author(s):
- Rencz,Marta ( Micred Ltd )
- Farkas,G.
- Szekely,Vladimir
- Poppe,A.
- Courtois,Bernard
- Publication title:
- Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4428
- Pub. Year:
- 2001
- Page(from):
- 268
- Page(to):
- 273
- Pages:
- 6
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780930815639 [0930815637]
- Language:
- English
- Call no.:
- P63600/4428
- Type:
- Conference Proceedings
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