"Vibration Fatigue, Failure Mechanism and Reliability of Plastic Ball Grid Array and Plastic Quad Flat Packages"

"Vibration Fatigue, Failure Mechanism and Reliability of Plastic Ball Grid Array and Plastic Quad Flat Packages"

Author(s):

Li,Ron S. ( Motorola Inc. )
Poglitsch,Larry

Publication title:

Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4428

Pub. Year:

2001

Page(from):

223

Page(to):

228

Pages:

6

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780930815639 [0930815637]

Language:

English

Call no.:

P63600/4428

Type:

Conference Proceedings

Details

TDL ID:	ZA00012142
Series ID:	PA00000029
Conf. info. (Name):	HD International Conference on High-Density Interconnect and Systems Packaging
Conf. info. (Number):	2001
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	2001.04.17-2001.04.20

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