Rapid Analytical Modeling of a Heat Transfer Device using the Engineering Equation Solver Software Package (EES)

Rapid Analytical Modeling of a Heat Transfer Device using the Engineering Equation Solver Software Package (EES)

Author(s):: Delano,Andy ( Agilent Technologies )
Publication title:: Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California
Title of ser.:: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:: 4428
Pub. Year:: 2001
Page(from):: 201
Page(to):: 206
Pages:: 6
Pub. info.:: Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:: 0277786X
ISBN:: 9780930815639 [0930815637]
Language:: English
Call no.:: P63600/4428
Type:: Conference Proceedings

Details

TDL ID:	ZA00012142
Series ID:	PA00000029
Conf. info. (Name):	HD International Conference on High-Density Interconnect and Systems Packaging
Conf. info. (Number):	2001
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	2001.04.17-2001.04.20

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