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Compact dynamic thermal multiport models of packages for MEMS-package cosimulation

Author(s):
Publication title:
Design, test, integration, and packaging of MEMS/MOEMS 2001 : 25-27 April 2001, Cannes, France
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4408
Pub. Year:
2001
Page(from):
415
Page(to):
423
Pages:
9
Pub. info.:
Bellingham, Washington: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819441096 [0819441090]
Language:
English
Call no.:
P63600/4408
Type:
Conference Proceedings

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