20-μm deep trench isolation process characterization for linear bipolar ICs

20-μm deep trench isolation process characterization for linear bipolar ICs

Author(s):

Dyer,T. ( National Semiconductor Ltd. )

Publication title:

Process and equipment control in microelectronic manufacturing II : 30-31 May, 2001, Edinburgh, UK

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4405

Pub. Year:

2001

Page(from):

117

Page(to):

122

Pages:

6

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819441065 [0819441066]

Language:

English

Call no.:

P63600/4405

Type:

Conference Proceedings

Details

TDL ID:	ZA00012121
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing Technologies : Process and Equipment Control in Microelectronic Manufacturing
Conf. info. (Number):	2001 : 2nd
Conf. info. (Venue):	Edinburgh, UK
Conf. info. (Date):	2001.05.30-2001.05.31

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