Polygate within wafer CD uniformity improvement by the minimization of lens heating effect

Polygate within wafer CD uniformity improvement by the minimization of lens heating effect

Author(s):

Chang,Y.S. ( Taiwan Semiconductor Manufacturing Co., Ltd. )
Wu,M.J.
Hung,M.Y.
Cheng,K.Y.
Hsieh,J.C.

Publication title:

Lithography for semiconductor manufacturing II : 30 May-1 June, 2001, Edinburgh, UK

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4404

Pub. Year:

2001

Page(from):

26

Page(to):

32

Pages:

7

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819441058 [0819441058]

Language:

English

Call no.:

P63600/4404

Type:

Conference Proceedings

Details

TDL ID:	ZA00012120
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing Technologies : Lithography for Semiconductor Manufacturing
Conf. info. (Number):	2001 : 2nd
Conf. info. (Venue):	Edinburgh, UK
Conf. info. (Date):	2001.05.30-2001.06.01

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