Organic BARC process evaluation for via first dual-damascene patterning

Organic BARC process evaluation for via first dual-damascene patterning

Author(s):

Tan,C.-H. ( Institute of Microelectronics )

Publication title:

Advances in Resist Technology and Processing XVIII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4345

Pub. Year:

2001

Vol.:

4345

Pt.:

Two of Two Parts

Page(from):

804

Page(to):

815

Pages:

12

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819440310 [0819440310]

Language:

English

Call no.:

P63600/4345

Type:

Conference Proceedings

Details

TDL ID:	ZA00012061
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in resist technology and processing
Conf. info. (Number):	2001 : 18th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2001.02.26-2001.02.28

Similar Items:

1 Conference Proceedings Evaluation of overlay measurement target designs for Cu dual-damascene process Mukherjee-Roy,M., Kumar,R., Samudra,G.S. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Integration using KrF and ArF resist materials in a full via first dual-damascene process scheme with CVD OSG low-k dielectric Jessen, S.W., Steiner, K.G., Wolf, T.M., Josephson, W.D., Lyle, S.A., Sato, M., Lee, C.Y., Fan, M.H. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Evaluation of alignment target designs for Cu and low-K dual damascene processes Mukherjee-Roy, M., Singh, N., Mehta, S.S., Chik, W.M., Sim, C.T., Cheong, F. SPIE-The International Society for Optical Engineering	8 Conference Proceedings 90-nm dual damascene patterning with a new via fill material Chen, C. J., Gao, X. Y., Lin, Y. S., Cheng, L. H., Kuo, C. C, Xing, G. Q., Zhou, D.-L., Muramatsu, M., Nakashima, M. SPIE - The International Society of Optical Engineering
3 Conference Proceedings Effect of hole shape error on lithography process window Kumar,R., Mukherjee-Roy,M., Tan,C.-H. SPIE-The International Society for Optical Engineering	9 Conference Proceedings Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process Bhave, M., Edwards, K., Washburn, C.A., Takei, S., Sakaida, Y., Nakajima, Y. SPIE - The International Society of Optical Engineering
4 Conference Proceedings Impact of scattering bars in damascene trench patterning Mehta, S.S., Singh, N., Mukherjee-Roy, M., Kumar, R. SPIE-The International Society for Optical Engineering	10 Conference Proceedings Planarization approaches to via-first dual-damascene processing Pavelchek,E.K., Cernigliaro,M., Trefonas,P., doCanto,M. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Optimization of the planarizing performance of a DUV organic bottom antireflective coating for via first dual-damascene process: cooperation to achieve material … Williams,P., Martin,A., Strobl,M., Roberts,W.R., Goodwin,F.G., Volkel,L., Feicke,A., Trautman,S., Lamb Ⅲ,J.E. SPIE-The International Society for Optical Engineering	11 Conference Proceedings Optimization of align marks and overlay targets in VIA first dual damascene process Shin, D.-U., Jeong, Y.-B., Park, J.-L., Choi, J.-S., Lee, J.-G., Lee, D.-H. SPIE-The International Society for Optical Engineering
6 Conference Proceedings Integration using inorganic BARC in a via-first dual-damascene process with low-k dielectric Ahn, J.K., Choi, S.H., Kim, Y.K., Park, K.Y., Choi, J.S., Hong, E.S., Shin, K.S., Kim, S.B., Choi, K.K., Hwang, S.B., … SPIE - The International Society of Optical Engineering	12 Conference Proceedings Via fill properties of organic BARCs in dual-damascene application Huang, R. SPIE - The International Society of Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12