High Reliability Interconnection Technology using Conductive Adhesive

High Reliability Interconnection Technology using Conductive Adhesive

Author(s):

Mitani,Tsutomu ( Matsushita Electric Industrial Co., Ltd. )

Publication title:

Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4339

Pub. Year:

2000

Page(from):

737

Page(to):

742

Pages:

6

Pub. info.:

Reston, VA: IMAPS

ISSN:

0277786X

ISBN:

9780930815622 [0930815629]

Language:

English

Call no.:

P63600/4339

Type:

Conference Proceedings

Details

TDL ID:	ZA00012055
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2000
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2000.09.20-2000.09.22

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