Flip Chip on Laminate Reliability-Accelerated Testing and Failure Analysis
- Author(s):
- Rocsch,Michael ( Hewlett-Packard Company )
- Teichner,Robert W.
- Martens,Rod
- Publication title:
- Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4339
- Pub. Year:
- 2000
- Page(from):
- 465
- Page(to):
- 470
- Pages:
- 6
- Pub. info.:
- Reston, VA: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815622 [0930815629]
- Language:
- English
- Call no.:
- P63600/4339
- Type:
- Conference Proceedings
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