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Flow Properties of Underfill Materials in Flip-Chip Packaging

Author(s):
Wang,Jinlin ( Intel Corporation )  
Publication title:
Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4339
Pub. Year:
2000
Page(from):
184
Page(to):
189
Pages:
6
Pub. info.:
Reston, VA: IMAPS
ISSN:
0277786X
ISBN:
9780930815622 [0930815629]
Language:
English
Call no.:
P63600/4339
Type:
Conference Proceedings

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