Reliability and Failure Analysis of CSP under Bending Cycling Test
- Author(s):
Huang,T.C. ( Advanced Semiconductor Engineering, Inc. ) Lai,D.P. Ho,S.H. Lee,Jo Zheng,P.J. Hwang,J.G. Wu,J.D. - Publication title:
- Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4339
- Pub. Year:
- 2000
- Page(from):
- 9
- Page(to):
- 14
- Pages:
- 6
- Pub. info.:
- Reston, VA: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815622 [0930815629]
- Language:
- English
- Call no.:
- P63600/4339
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
On the reliability and failure of PBGA Interconnects under Bending Cyclic Test
IMAPS |
7
Technical Paper
Investigation of Failure Models in the DEXRON III- H GM Cycling and Oxidation Tests.
Society of Automotive Engineers |
IMAPS |
American Institute of Aeronautics and Astronautics |
SPIE - The International Society for Optical Engineering |
9
Conference Proceedings
Analysis of optical fiber failures under bending and high power (Invited Paper)
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
Materials Research Society |
National Aeronautics and Space Administration |
SPIE - The International Society for Optical Engineering |
6
Conference Proceedings
A Study of Solder Joint Reliability of TFBGA Assemblies with Fresh and Reworked Solder Balls
IMAPS |
Society of Plastics Engineers |