Packaging and characterization equipment for high-power diode laser bars and VCSELs
- Author(s):
Boucke,K. ( Fraunhofer Institute for Laser Technology ) Jandeleit,J. Brandenburg,W. Ostlender,A. Loosen,P. Poprawe,R. - Publication title:
- Testing, Reliability, and Applications of Optoelectronic Devices
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4285
- Pub. Year:
- 2001
- Page(from):
- 165
- Page(to):
- 172
- Pages:
- 8
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819439635 [0819439630]
- Language:
- English
- Call no.:
- P63600/4285
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society for Optical Engineering |
7
Conference Proceedings
Expansion-matched passively cooled heatsinks with low thermal resistance for high-power diode laser bars [6104-03]
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
8
Conference Proceedings
High-power diode laser bars with 19 up to 48 individually addressable emitters
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
Characterization of tapered diode laser bars for the use in high-power diode laser systems
SPIE - The International Society of Optical Engineering |
12
Conference Proceedings
High-power laser bars with emission in the red spectral range for medical applications
Society of Photo-optical Instrumentation Engineers |