Chemical imaging of microuias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy

Chemical imaging of microuias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy

Author(s):

Publication title:

Microelectronic Yield, Reliability, and Advanced Packaging

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4229

Pub. Year:

2000

Page(from):

168

Page(to):

175

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819439017 [0819439010]

Language:

English

Call no.:

P63600/4229

Type:

Conference Proceedings

Details

TDL ID:	ZA00011947
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic yield, reliability, and advanced packaging
Conf. info. (Number):	2000
Conf. info. (Venue):	Singapore
Conf. info. (Date):	2000.11.28-2000.11.30

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