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Test and reliability analysis of PBGA assemblies under random vibration

Author(s):
Yang,Q.
Wang,Z.
Lim,G.H.
Pang,H.L.J.
Yap,F.F.
Lin,R.
1 more
Publication title:
Microelectronic Yield, Reliability, and Advanced Packaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4229
Pub. Year:
2000
Page(from):
116
Page(to):
122
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819439017 [0819439010]
Language:
English
Call no.:
P63600/4229
Type:
Conference Proceedings

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