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Electromigration failure modes and Blech effect in single-inlaid Cu interconnects

Author(s):
Thrasher,S.
Capasso,C.
Zhao,L.
Hernandez,R.
Mulski,P.
Rose,S.
Nguyen,T.
Kawasaki,H.
3 more
Publication title:
Microelectronic Yield, Reliability, and Advanced Packaging
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4229
Pub. Year:
2000
Page(from):
1
Page(to):
7
Pages:
7
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819439017 [0819439010]
Language:
English
Call no.:
P63600/4229
Type:
Conference Proceedings

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