Photoformed Thick Film Materials and their Application to Fine Feature Circuitry

Photoformed Thick Film Materials and their Application to Fine Feature Circuitry

Author(s):

Publication title:

2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4217

Pub. Year:

2000

Page(from):

579

Page(to):

584

Pages:

6

Pub. info.:

Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical

ISSN:

0277786X

ISBN:

9780930815608 [0930815602]

Language:

English

Call no.:

P63600/4217

Type:

Conference Proceedings

Details

TDL ID:	ZA00011936
Series ID:	PA00000029
Conf. info. (Name):	HD International Conference on High-Density Interconnect and Systems Packaging
Conf. info. (Number):	2000
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	2000.04.25-2000.04.28

Similar Items:

1 Conference Proceedings The Ultimate Thick Film Gold Composition Ollivier,P.J., Bacher,R.J., Crumpton,J.C. IMAPS	7 Conference Proceedings Resist rehydration during thick film processing Lehar,O.P., Spak,M.A., Meyer,S., Dammel,R.R., Brodsky,C.J., Willson,C.G. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Preparation of Macroporous SnO2 Thick Films and Their Application to Sensor Materials Ishibashi, T., Hyodo, T., Shimizu, Y., Egashira, M. (Nagasaki University) Electrochemical Society	8 Conference Proceedings Applications of LIGA on Micro-Punching Process for Metallic Materials Pan, C.T., Cheng, P.J., Shen, S.C., Chen, M.F., Wang, R.Y., Chou, M.C., Wu, T.C. Trans Tech Publications
3 Conference Proceedings Battery Applications of Extra Fine INCO Type 210 Nickel Powder Kalal, P.J., Timberg, L.M., Ettel, V.A. Electrochemical Society	9 Conference Proceedings The Quality of Thin Silicon Films Determined by an Atomic Force Microscope (AFM) R.I. Hegde, M.A. Chanko, P.J. Tobin Electrochemical Society
4 Conference Proceedings Next Generation Ceramic Multilayer System Bacher,R.J., Wang,Y.L., Skurski,M.A., Crumpton,J.C., Nair,K.M. IMAPS	10 Conference Proceedings Selection of IR optical materials for low-mass applications Rogers,P.J. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Electronic circuitry development in a micropyrotechnic system for micropropulsion applications Puig-Vidal, M., Lopez, J., Miribel, P., Montane, E., Lopez-Villegas, J.M., Samitier, J., Rossi, C., Camps, T., … SPIE-The International Society for Optical Engineering	11 Conference Proceedings THE USE OF GRAVURE OFFSET PRINTING IN THE REALISATION OF FINE LINE THICK FILM CONDUCTORS Leppavuori, S., Vaananen, J., Lahti, M., Kukkola, K., Uusimaki, A. MRS - Materials Research Society
6 Conference Proceedings Composite Films of Platinum Particles highly Dispersed in Tungsten Oxides as Bifunctional Electrocatalysts for Oxygen Reduction Kulesza, P.J., Malik, M.A. Electrochemical Society	12 Conference Proceedings MICROSTRUCTURE AND INTEGRITY OF THIN SILICON FILMS ON SiO2 AFTER IMMERSION IN 10:1 BUFFERED HF Hegde, R.I., Chonko, M.A., Tobin, P.J. Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12