Blank Cover Image

Ultra-High Density Magnetic Heads

Author(s):
Publication title:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4217
Pub. Year:
2000
Page(from):
491
Page(to):
495
Pages:
5
Pub. info.:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
Language:
English
Call no.:
P63600/4217
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings MEMS Packaging Issues and Materials

Gilleo,Ken

IMAPS

Ouchi, K.

Electrochemical Society

Gilleo,Ken

IMAPS, SPIE-The International Society for Optical

Nicholls T. J., Dresselhaus G.

Plenum Press

3 Conference Proceedings The Great Underfill Race

Gilleo,Ken, Blumel,David

SPIE - The International Society for Optical Engineering, IMAPS

Omata, Y., Asai, H., Komura, N.

Electrochemical Society

Gilleo,Ken, Blumel,David

IMAPS, SPIE-The International Society for Optical

Gavriliuk, A. G., Stepanov, G. N., Trojan, I. A., Sidorov, V. A., Lyubutin, I. S., Palosz, B., Stel'makh, S., Winzenick, …

MRS - Materials Research Society

Fedeli M. J.

Kluwer Academic Publishers

Lodder, J.C., Haast, M.A.M., Abelmann, L.

Kluwer Academic Publishers

Bain,J.A.

SPIE-The International Society for Optical Engineering

Futamoto, M., Hirayama, Y., Honda, Y., Kikukawa, A.

Kluwer Academic Publishers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12