Study on the Structures of Buried Type Capacitor for MCM (Multi-Chip-Module)

Study on the Structures of Buried Type Capacitor for MCM (Multi-Chip-Module)

Author(s):

Yoo,ChanSei

Publication title:

2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4217

Pub. Year:

2000

Page(from):

320

Page(to):

324

Pages:

5

Pub. info.:

Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical

ISSN:

0277786X

ISBN:

9780930815608 [0930815602]

Language:

English

Call no.:

P63600/4217

Type:

Conference Proceedings

Details

TDL ID:	ZA00011936
Series ID:	PA00000029
Conf. info. (Name):	HD International Conference on High-Density Interconnect and Systems Packaging
Conf. info. (Number):	2000
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	2000.04.25-2000.04.28

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