Blank Cover Image

Characterization of Buried Resistor for RF MCM-C Design

Author(s):
Cho,H.M.
Yoo,C.S.
Lim,W.
Lee,W.S.
Kwak,S.B.
Kang,N.K.
Park,J.C.
2 more
Publication title:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4217
Pub. Year:
2000
Page(from):
192
Page(to):
195
Pages:
4
Pub. info.:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
Language:
English
Call no.:
P63600/4217
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Study on the Structures of Buried Type Capacitor for MCM (Multi-Chip-Module)

Yoo,ChanSei, Cho,H.M., Kang,N.K., Kwak,S.B., Lee,W.S., Lim,W., Park,J.C.

IMAPS, SPIE-The International Society for Optical
7 Conference Proceedings Porous TiO2 Layer Encapsulated Silicon as the Anode Material for Lithium Secondary Batteries

B.E. Kim, S.E. Park, S.W. Lee, J.C. Lim, B.W. Cho

Trans Tech Publications
2 Conference Proceedings Characteristics of Miniatured VCO (Voltage Controlled Oscillator) for IMT-2K using MCM-C Technology

Yoo,C.S., Lee,Y.S., Lee,W.S., Kwak,S.B., Kang,N.K., Park,J.C.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Constitutive Analysis of the High-Temperature Deformation Behavior of Single Phase α-Ti and α+β Ti-6Al-4V Alloy

J.H. Kim, J.T. Yeom, N.K. Park, C.S. Lee

Trans Tech Publications
3 Conference Proceedings Leakage characteristics for the buried photodiode structure on vertical CMOS image sensors

S. Lee, S. Lim, C. Lee, J. Park, S. Bang, S. Kang, R. A. Martin, S. Bae, J. W. Park

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Ultra-Shallow Junction Implant Anneal Using Xenon Arc Flash Lamps

Yoo, W.S., Kang, K.

Electrochemical Society
4 Conference Proceedings Residual Stress Characterization of Electroformed Ni-Base Alloy for µ-Gear Mold

S.H. Son, S.C. Park, H.M. Kim, W.S. Lee, H.K. Lee

Trans Tech Publications
10 Conference Proceedings 15 Ultra-shallow implant anneal using a short-wavelength flash light source

Yoo, W.S., Kang, K.

Electrochemical Society
5 Conference Proceedings Incorporating an End-of-Life Strategy into Materials Design Simulation of Electric Upsetting and Forging Process for Large Marine Diesel Engine Exhaust Valves

Jeong, H.S., Cho, J.R., Lee, N.K., Park, H.C.

Trans Tech Publications
11 Conference Proceedings Effect of Grinding and Extraction of Lignocellulosic Fiber on Oil Sorption

B.G. Lee, H.J. Lee, D.Y. Shin, Y.H. Jeong, J.C. Wu, D.H. Cho, K.Y. Lee, D.E. Kim, W.S. Kang, Y.G. Goh

Trans Tech Publications
6 Conference Proceedings Microstructure and Thermoelectric Properties of P-Type Bi0.5Sb1.5Te3 Compounds Prepared by Spark Plasma Sintering

Cho, W.S., Cho, D.C., Lim, C.H., Lee, C.H., Hwang, W.S., Yoo, Y.C.

Trans Tech Publications
12 Conference Proceedings Texture Evolution in Ni Substrate Prepared by Powder Metallurgy and Casting Methods

J.H. Lim, K.T. Kim, E.C. Park, J.H. Joo, H.S. Kim, H.J. Lee, S.B. Jung, W.S. Nah

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12