Blank Cover Image

Chip Scale Polymer Stud Grid Array Packaging and Reliability Based on Low Cost Flip Chip Processing

Author(s):
Publication title:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4217
Pub. Year:
2000
Page(from):
118
Page(to):
122
Pages:
5
Pub. info.:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
Language:
English
Call no.:
P63600/4217
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings WAFER SCALE PACKAGING BASED ON UNDERFILL APPLIED AT WAFER LEVEL FOR LOW COST FLIP CHIP PROCESSING

Johnson,C.Dustin, Baldwin,Daniel F.

IMAPS
7 Conference Proceedings Thermosonic Flip Chip Bonding for Low Cost Packaging

Tomioka, Taizo, Iguchi, Tomohiro, Mori, Ikuo, Saito, Masayuki

IMAPS
2 Conference Proceedings Flip Chip Ball Grid Array Packaging for RFICs

Hung,C.P., Wu,Larry, Chiu,C.T., Hsieh,J.S., Lee,J.J.

IMAPS
8 Conference Proceedings "A Modular, Direct-Chip-Arrach MEMS Package: Architecture and Processing"

Neysmith,Jordan, Baldwin,Daniel F.

IMAPS
3 Conference Proceedings Initial Development Work on a High Throughput Low Cost Flip Chip on Board Assembly Process

McGovern,Lawrende.P., Baldwin,Daniel.F.

IMAPS
9 Conference Proceedings Assembly and Reliability of 'Large Die' Flip-Chip Chip Scale Packages

Gaffney,Kevin, Erich,Robert

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Low Cost Underbump Metallisation for Flip-Chip Packages

Yap, K.P., Cui, C.Q., Lahiri, S.K.

Electrochemical Society
10 Conference Proceedings Board Level Reliability of Chip Scale Packages

Hung,Sung-Ching, Zheng,P.J., Chen,H.N., Lee,S.C., Lee,J.J.

SPIE - The International Society for Optical Engineering
5 Conference Proceedings THERMO-MECHNICAL DESIGN OF FLIP CHIPS FOR HARSH ENVIRONMENTS

Michaelides,Stelios, Sitaraman,Suresh

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Transfer Molding Encapsulation of Flip Chip Array Packages

Rector,Louis P., Gong,Shaoqin, Miles,Tara R., Gaffney,Kevin

IMAPS
6 Conference Proceedings Preliminary In-Process Stress Analysis of Flip-Chip Assemblies During Underfill

Palaniappan,Prema., Baldwin,Daniel.F.

IMAPS
12 Conference Proceedings CHIP SCALE PACKAGING WITH HIGH RELLABILITY FOR MCM APPLICATIONS

Loboda,Mark, Camilletti,R.C., Goodman,L.A., White,L., Pinch,H.L., Shaw,J., Patel,V.K., Wu,C.P., Adema,G.M.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12