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Analysis of Thermal Management in the System Assembly of High Denstty Chip Size Packages

Author(s):
Publication title:
2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4217
Pub. Year:
2000
Page(from):
32
Page(to):
39
Pages:
8
Pub. info.:
Reston, VA — Bellingham, Wash.: IMAPS — SPIE-The International Society for Optical
ISSN:
0277786X
ISBN:
9780930815608 [0930815602]
Language:
English
Call no.:
P63600/4217
Type:
Conference Proceedings

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