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Nano-spring arrays for high-density interconnect

Author(s):
Fork,D.K.
Chua,C.L.
Kim,P.
Romano,L.T.
Lau,R.
Wong,L.
Alimonda,A.
Geluz,V.
Teepe,M.
Haemer,J.
Modi,M.
Zhu,Q.
Ma,D.
Sitaraman,S.
Smith,D.L.
Mok,S.
11 more
Publication title:
Micromachined Devices and Components VI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4176
Pub. Year:
2000
Page(from):
226
Page(to):
235
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819438324 [0819438324]
Language:
English
Call no.:
P63600/4176
Type:
Conference Proceedings

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