Investigation of thermopile using CMOS compatible process and front-side Si bulk etching
- Author(s):
- Publication title:
- Micromachined Devices and Components VI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4176
- Pub. Year:
- 2000
- Page(from):
- 168
- Page(to):
- 178
- Pages:
- 11
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819438324 [0819438324]
- Language:
- English
- Call no.:
- P63600/4176
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society for Optical Engineering |
7
Conference Proceedings
Characterization of waferstepper and process related front- to backwafer overlay errors in bulk micromachining using electrical overlay test structures
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
3
Conference Proceedings
Highly Sensitive Infrared Temperature Sensor for CMOS Compatible Thermopiles
Trans Tech Publications |
9
Conference Proceedings
Bulk micromachining of SOI wafers using double-sided lithography and anisotropic wet etching
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
5
Conference Proceedings
Eluding Metal Contamination in CMOS Front-End Fabrication by Nanocrystal Formation Process
Materials Research Society |
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
Eluding Metal Contamination in CMOS Front-End Fabrication by Nanocrystal Formation Process
Materials Research Society |
Materials Research Society |