Development of a low-stress silicon-rich nitride film for micromachined sensor applications
- Author(s):
- Publication title:
- Micromachining and microfabrication process technology VI : 18-20 September 2000, Santa Clara, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4174
- Pub. Year:
- 2000
- Page(from):
- 436
- Page(to):
- 442
- Pages:
- 7
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819438300 [0819438308]
- Language:
- English
- Call no.:
- P63600/4174
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Release etch modeling analysis and the use of laser scanning microscopy for etch time prediction of micromachined structures
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
2
Conference Proceedings
LOW STRESS SILICON NITRIDE AND POLYSILICON FILMS FOR MICROMACHINING APPLICATIONS
Materials Research Society |
8
Conference Proceedings
Determination of residual stress in low-temperature PECVD silicon nitride thin films
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society for Optical Engineering |
Electrochemical Society |
10
Conference Proceedings
Stress Generation in PECVD silicon Nitride Thin Films for Microelectronics Applications
Materials Research Society |
SPIE - The International Society for Optical Engineering |
11
Conference Proceedings
Stress Generation in PECVD Silicon Nitride Thin Films for Microelectronics Applications
Materials Research Society |
6
Conference Proceedings
Development of polysilicon films for MEMS intergration with submicron COMS process
SPIE-The International Society for Optical Engineering |
Materials Research Society |