Modeling Residual Stresses in Thermosetting Materials
- Author(s):
- Prasatya, P. ( University of Pittsburgh )
- McKenna, G. B. ( Texas Tech University )
- Simon, S. L.
- Publication title:
- ANTEC 2000 Conference proceedings, May 7-11, 2000, Orlando, Florida
- Title of ser.:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- Ser. no.:
- 46
- Pub. Year:
- 2000
- Pt.:
- 1
- Page(from):
- 2102
- Page(to):
- 2106
- Pages:
- 5
- Pub. info.:
- Brookfield Center, CT: Society of Plastics Engineers, Inc. (SPE)
- ISBN:
- 9781566768559 [1566768551]
- Language:
- English
- Call no.:
- S42700/46
- Type:
- Conference Proceedings
Similar Items:
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
2
Conference Proceedings
Effect of Cure Cycle on Residual Stress Development in Thermosetting Materials
Society of Plastics Engineers |
Society of Plastics Engineers |
3
Conference Proceedings
Isotropic Residual Stresses in Thermosetting Resins: A New Instrument for Direct Measurement (1003)
Society of Plastic Engineers. |
9
Conference Proceedings
Measurement of Thermal Conductivity Using Temperature-Modulated Differential Scanning Calorimetry: Solution to the Heat Flow Problem
Society of Plastics Engineers, Inc. (SPE) |
4
Conference Proceedings
Isotropic Residual Stresses in Thermosetting Resins: Modeling and the Effects of Resin Modification properties
Society of Plastics Engineers |
Society of Plastics Engineers, Inc. (SPE) |
Society of Plastics Engineers, Inc. (SPE) |
11
Conference Proceedings
Evaluation of Different Methods of Measurement for the Isotropic Stress Development in Curing Thermosets
Society of Plastics Engineers |
Society of Plastics Engineers |
Society of Plastics Engineers, Inc. (SPE) |