Quantitative Modelling and Measurement of Copper Thin Film Adhesion
- Author(s):
- Publication title:
- Fracture and ductile vs. brittle behavior--theory, modelling, and experiment : symposium held November 30-December 3, 1998, Boston, Massachusetts, U.S.A.
- Title of ser.:
- Materials Research Society symposium proceedings
- Ser. no.:
- 539
- Pub. Year:
- 1999
- Page(from):
- 277
- Pub. info.:
- Warrendale, Pa.: MRS - Materials Research Society
- ISSN:
- 02729172
- ISBN:
- 9781558994454 [1558994459]
- Language:
- English
- Call no.:
- M23500/539
- Type:
- Conference Proceedings
Similar Items:
1
Conference Proceedings
Quantitative Measurement of the Effect of Annealing on the Adhesion of Thin Copper Films Using Superlayers
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
MRS - Materials Research Society |
4
Conference Proceedings
Experimental Considerations for Indentation-Induced Adhesion Measurement of Multilayered Thin Films
MRS - Materials Research Society |
10
Conference Proceedings
Acoustic Emission Analysis of Fracture Events in Cu Films with W Overlayers
MRS - Materials Research Society |
MRS-Materials Research Society |
11
Conference Proceedings
Superlayer residual stress effect on the indentation adhesion measurements
MRS-Materials Research Society |
6
Conference Proceedings
*Annealing effects on interfacial fracture of gold-chromium films in hybrid microcircuits
MRS-Materials Research Society |
Materials Research Society |