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In Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip-Chip Packaging Using Moire Interferometry

Author(s):
Publication title:
Electronic packaging materials science IX : symposium held December 2-5, 1996, Boston, Massachusetts, U.S.A.
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
445
Pub. Year:
1997
Page(from):
167
Pub. info.:
Pittsburgh, Pa.: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558993495 [1558993495]
Language:
English
Call no.:
M23500/445
Type:
Conference Proceedings

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