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High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging (Invited Paper)

Author(s):
Liu,Y.S. ( GE Corporate Research and Development Ctr. )
Wojnarowski,R.J. ( GE Corporate Research and Development Ctr. )
Hennessy,W.A. ( GE Corporate Research and Development Ctr. )
Piacente,P.A. ( GE Corporate Research and Development Ctr. )
Rowlette,Sr.,J.R. ( AMP Inc. )
Kadar-Kallen,M.A. ( AMP Inc. )
Stack,J.D. ( AMP Inc. )
Liu,Y. ( Honeywell Technology Ctr. )
Peczalski,A. ( Honeywell Technology Ctr. )
Nahata,A. ( AlliedSignal Inc. )
5 more
Publication title:
Optoelectronic Interconnects V
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
3288
Pub. Year:
1998
Page(from):
60
Page(to):
72
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819427274 [0819427276]
Language:
English
Call no.:
P63600/3288
Type:
Conference Proceedings

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