High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging (Invited Paper)
- Author(s):
Liu,Y.S. ( GE Corporate Research and Development Ctr. ) Wojnarowski,R.J. ( GE Corporate Research and Development Ctr. ) Hennessy,W.A. ( GE Corporate Research and Development Ctr. ) Piacente,P.A. ( GE Corporate Research and Development Ctr. ) Rowlette,Sr.,J.R. ( AMP Inc. ) Kadar-Kallen,M.A. ( AMP Inc. ) Stack,J.D. ( AMP Inc. ) Liu,Y. ( Honeywell Technology Ctr. ) Peczalski,A. ( Honeywell Technology Ctr. ) Nahata,A. ( AlliedSignal Inc. ) - Publication title:
- Optoelectronic Interconnects V
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3288
- Pub. Year:
- 1998
- Page(from):
- 60
- Page(to):
- 72
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819427274 [0819427276]
- Language:
- English
- Call no.:
- P63600/3288
- Type:
- Conference Proceedings
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