Finite element analysis of thermal stresses in laser packaging
- Author(s):
Sheen,M.-T. ( National Sun Yat-Sen Univ.(Taiwan) ) Chen,C.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Kuang,J.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Cheng,W.-H. ( National Sun Yat-Sen Univ.(Taiwan) ) Chang,H.-L. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,S.-C. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,C. ( Chunghwa Telecom Labs. (Taiwan) ) Wang,C.-M. ( Chunghwa Telecom Labs. (Taiwan) ) Liaw,J.-W. ( Chunghwa Telecom Labs. (Taiwan) ) - Publication title:
- Optoelectronic Materials and Devices
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 3419
- Pub. Year:
- 1998
- Page(from):
- 93
- Page(to):
- 101
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819428738 [0819428736]
- Language:
- English
- Call no.:
- P63600/3419
- Type:
- Conference Proceedings
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