Blank Cover Image

Post-CMP Cleaning of W and SiO2: A Model Study

Author(s):
Malik, Igor J.
Zhang, Jackie
Jensen, Alan J.
Farber, Jeffrey J.
Krusell, Wilbur C.
Raghavan, Srini
Rajhunath, Chilkunda
2 more
Publication title:
Ultraclean semiconductor processing technology and surface chemical cleaning and passivation : Symposum held April 17-19, 1995, San Francisco, California, USA
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
386
Pub. Year:
1995
Page(from):
109
Pub. info.:
Pittsburgh, PA: MRS - Materials Research Society
ISSN:
02729172
ISBN:
9781558992894 [1558992898]
Language:
English
Call no.:
M23500/386
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Cleaning of SiO2: Differences Between Thermal and Deposited Oxides

Ravkin, M., Farber, J. J., Malik, I. J., Zhang, J., Jensen, A. J., Larios, J. M. de, Krusell, W. C.

MRS - Materials Research Society
7 Conference Proceedings POST W CMP CLEANING

Constant, I., Marthon, S., Lardin, T., David, C., Jacquemond, M.N., Tardif, F.

Electrochemical Society
2 Conference Proceedings DOUBLE-SIDE WAFER SCRUBBING BEYOND POST-CMP CLEANING

Krusell, Wilbur C., Malik, Igor J., Mohr, Fred, Hymes, Diane J.

Electrochemical Society
8 Conference Proceedings Mechanisms of Post-CMP Cleaning

Liang, H., Estragnat, E., Lee, J., Bahten, K., McMullen, D.

Materials Research Society
3 Conference Proceedings ASPECTS OF ALUMINA PARTICLE DEPOSITION ONTO CVD TUNGSTEN WAFERS RELEVANT TO POST CMP CLEANING

Jeon, Joong S., Raghunath, Chilkunda, Kneer, Emil A., Raghavan, Srini

Electrochemical Society
9 Conference Proceedings Enhancement of Post Copper CMP Cleaning Using CO2 Cryogenic Technology

Banerlee, S., Chung, H.F., Small, R., Shang, C.

Electrochemical Society
4 Conference Proceedings Chemical Mechanical Cleaning for Post-CMP Applications: Defects and Metals Results

Zhao, E. Y., Emami, R., Malik, I., Mishra, K., Krusell, W. C., Larios, J. de, Hymes, D. J.

MRS - Materials Research Society
10 Conference Proceedings NEW APPROACH FOR STUDY OF PARTICLE ADHESION AND REMOVAL RELEVANT TO POST CMP CLEANING

Lee, S.-Y., Lee, S.-H., Eom, D.-H., Kim, K.-S., Song, H.-S., Park, J.-G.

Electrochemical Society
5 Conference Proceedings Influence of Post-CMP Cleaning on Cu Surface

Jeffrey Barnes, Peng Zhang, Alfred Miller

Materials Research Society
11 Conference Proceedings Evaluation of Copper Oxide to Copper Selectivity of Chemical System for BEOL Cleaning Through Electrochemical Investigations

Nandini Venkataraman, Ashok Kumar Muthukumaran, Srini Raghavan

Materials Research Society
6 Conference Proceedings Post W CMP Cleaning Without HF Cleans

Y. Kang, C. Yang, T. Kwon, J. Park, J. Jo

Electrochemical Society
12 Conference Proceedings A Study of the Planarity by STI CMP Erosion Modeling

Chung, U. I., Hah, S. R., Han, J. H., Hong, C. K., Kang, G. W., Kim, K. H.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12