Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis

Modelling of Failure in Metallic Thin Films Induced By Stress and Electromigration: A Multiscale Computational Analysis

Author(s):

Publication title:

Multiscale modelling of materials : symposium held November 30-December 3, 1998, Boston, Massachusets, U.S.A.

Title of ser.:

Materials Research Society symposium proceedings

Ser. no.:

538

Pub. Year:

1999

Page(from):

263

Pub. info.:

Warrendale, Pa.: MRS - Materials Research Society

ISSN:

02729172

ISBN:

9781558994447 [1558994440]

Language:

English

Call no.:

M23500/538

Type:

Conference Proceedings

Details

TDL ID:	ZA00020316
Series ID:	PA00000011
Conf. info. (Name):	Symposium on multiscale modelling of materials
Conf. info. (Number):	1998
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	1998.11.30-1998.12.03

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